作者： jiyang01

MKP473K275V
X2-MKP为无感结构，用金属化聚丙烯膜作为电介质/电极卷绕而成，导线采用镀锡铜包钢线，使用环氧树脂密封在塑料壳内。
X2-MKP are non-inductively wound with metallized Polypropylene film as the dielectric/electrodewith copper-clad steel leads and encapsulated in a plastic case sealed with epoxy resin.

MKP393K275V
X2-MKP为无感结构，用金属化聚丙烯膜作为电介质/电极卷绕而成，导线采用镀锡铜包钢线，使用环氧树脂密封在塑料壳内。
X2-MKP are non-inductively wound with metallized Polypropylene film as the dielectric/electrodewith copper-clad steel leads and encapsulated in a plastic case sealed with epoxy resin.

MKP363K275V
X2-MKP为无感结构，用金属化聚丙烯膜作为电介质/电极卷绕而成，导线采用镀锡铜包钢线，使用环氧树脂密封在塑料壳内。
X2-MKP are non-inductively wound with metallized Polypropylene film as the dielectric/electrodewith copper-clad steel leads and encapsulated in a plastic case sealed with epoxy resin.

MKP333K275V
X2-MKP为无感结构，用金属化聚丙烯膜作为电介质/电极卷绕而成，导线采用镀锡铜包钢线，使用环氧树脂密封在塑料壳内。
X2-MKP are non-inductively wound with metallized Polypropylene film as the dielectric/electrodewith copper-clad steel leads and encapsulated in a plastic case sealed with epoxy resin.

MKP273K275V
X2-MKP为无感结构，用金属化聚丙烯膜作为电介质/电极卷绕而成，导线采用镀锡铜包钢线，使用环氧树脂密封在塑料壳内。
X2-MKP are non-inductively wound with metallized Polypropylene film as the dielectric/electrodewith copper-clad steel leads and encapsulated in a plastic case sealed with epoxy resin.

MKP223K275V
X2-MKP为无感结构，用金属化聚丙烯膜作为电介质/电极卷绕而成，导线采用镀锡铜包钢线，使用环氧树脂密封在塑料壳内。
X2-MKP are non-inductively wound with metallized Polypropylene film as the dielectric/electrodewith copper-clad steel leads and encapsulated in a plastic case sealed with epoxy resin.

MKP183K275V
X2-MKP为无感结构，用金属化聚丙烯膜作为电介质/电极卷绕而成，导线采用镀锡铜包钢线，使用环氧树脂密封在塑料壳内。
X2-MKP are non-inductively wound with metallized Polypropylene film as the dielectric/electrodewith copper-clad steel leads and encapsulated in a plastic case sealed with epoxy resin.

MKP153K275V
X2-MKP为无感结构，用金属化聚丙烯膜作为电介质/电极卷绕而成，导线采用镀锡铜包钢线，使用环氧树脂密封在塑料壳内。
X2-MKP are non-inductively wound with metallized Polypropylene film as the dielectric/electrodewith copper-clad steel leads and encapsulated in a plastic case sealed with epoxy resin.

MKP123K275V
X2-MKP为无感结构，用金属化聚丙烯膜作为电介质/电极卷绕而成，导线采用镀锡铜包钢线，使用环氧树脂密封在塑料壳内。
X2-MKP are non-inductively wound with metallized Polypropylene film as the dielectric/electrodewith copper-clad steel leads and encapsulated in a plastic case sealed with epoxy resin.

MKP103K275V
X2-MKP为无感结构，用金属化聚丙烯膜作为电介质/电极卷绕而成，导线采用镀锡铜包钢线，使用环氧树脂密封在塑料壳内。
X2-MKP are non-inductively wound with metallized Polypropylene film as the dielectric/electrodewith copper-clad steel leads and encapsulated in a plastic case sealed with epoxy resin.