月度归档： 2026 年 7 月

MKP474K275V
X2-MKP为无感结构，用金属化聚丙烯膜作为电介质/电极卷绕而成，导线采用镀锡铜包钢线，使用环氧树脂密封在塑料壳内。
X2-MKP are non-inductively wound with metallized Polypropylene film as the dielectric/electrodewith copper-clad steel leads and encapsulated in a plastic case sealed with epoxy resin.

MKP394K275V
X2-MKP为无感结构，用金属化聚丙烯膜作为电介质/电极卷绕而成，导线采用镀锡铜包钢线，使用环氧树脂密封在塑料壳内。
X2-MKP are non-inductively wound with metallized Polypropylene film as the dielectric/electrodewith copper-clad steel leads and encapsulated in a plastic case sealed with epoxy resin.

MKP364K275V
X2-MKP为无感结构，用金属化聚丙烯膜作为电介质/电极卷绕而成，导线采用镀锡铜包钢线，使用环氧树脂密封在塑料壳内。
X2-MKP are non-inductively wound with metallized Polypropylene film as the dielectric/electrodewith copper-clad steel leads and encapsulated in a plastic case sealed with epoxy resin.

MKP334K275V
X2-MKP为无感结构，用金属化聚丙烯膜作为电介质/电极卷绕而成，导线采用镀锡铜包钢线，使用环氧树脂密封在塑料壳内。
X2-MKP are non-inductively wound with metallized Polypropylene film as the dielectric/electrodewith copper-clad steel leads and encapsulated in a plastic case sealed with epoxy resin.

MKP274K275V
X2-MKP为无感结构，用金属化聚丙烯膜作为电介质/电极卷绕而成，导线采用镀锡铜包钢线，使用环氧树脂密封在塑料壳内。
X2-MKP are non-inductively wound with metallized Polypropylene film as the dielectric/electrodewith copper-clad steel leads and encapsulated in a plastic case sealed with epoxy resin.

MKP224K275V
X2-MKP为无感结构，用金属化聚丙烯膜作为电介质/电极卷绕而成，导线采用镀锡铜包钢线，使用环氧树脂密封在塑料壳内。
X2-MKP are non-inductively wound with metallized Polypropylene film as the dielectric/electrodewith copper-clad steel leads and encapsulated in a plastic case sealed with epoxy resin.

MKP X2金属化聚丙烯膜安规 […]

MKP154K275V
X2-MKP为无感结构，用金属化聚丙烯膜作为电介质/电极卷绕而成，导线采用镀锡铜包钢线，使用环氧树脂密封在塑料壳内。
X2-MKP are non-inductively wound with metallized Polypropylene film as the dielectric/electrodewith copper-clad steel leads and encapsulated in a plastic case sealed with epoxy resin.

MKP X2金属化聚丙烯膜安规 […]

MKP104K275V
X2-MKP为无感结构，用金属化聚丙烯膜作为电介质/电极卷绕而成，导线采用镀锡铜包钢线，使用环氧树脂密封在塑料壳内。
X2-MKP are non-inductively wound with metallized Polypropylene film as the dielectric/electrodewith copper-clad steel leads and encapsulated in a plastic case sealed with epoxy resin.